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Quick Turnaround; 24 Hours to 3 Days Based on Complexity
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| Thermal Management Solutions |
| Valor Genesis Design Rules Check (DRC) |
| Gerber to CAD Netlist Comparison |
| Prototype to Production Quantities and Virtual Manufacturing |
| Net List Testing: Flying Probe and Bed of Nails |
| TDR Testing for Impedance: Single Ended & Differential Pairs |
| Engineering Support Services for Impedance Modeling, SI, and Fabrication |
| Design Rules |
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Layer Stack-Up and Special Materials Consulting |
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| 2 to 44 Layers |
| Impedance Modeling and Layer Stack Up Generation |
| Controlled Impedance: Zo, Zd and Rambus |
| Buried Capacitance & Buried Resistors |
| Trace Widths Down to 3 mils, Spacing Down to 3 mils |
| Blind & Buried Vias and Microvias |
| FR4, STABLCOR, Teflon, BI, BT, Polyimide, Duroid, Thermount, Rogers (all Materials) |
| High Temp Epoxy, and Low Loss Epoxy (FR408, N4000-13 & -13SI, N6000SI) |
| Gold Body (Hard and Wire Bondable), Ni/Pd/Au, Entek, HASL Surface Finishes |
| BGA, Micro BGA, COB, SMT, PTH, & Edge Plating |
| Heatsinks, Metal Core, Cu/In/Cu, Cu/Mo/Cu |
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