True Ceramic Hybrid / MCM EDA and CAD Software in One Environment with the Flexibility you need!

EPD’s LTCC Design Tool is now complete CAD and CAM

As Ceramic Hybrid and MCM designs move into the future and requirements for ever-changing design features, and manufacturing and assembly processes continue to grow, why struggle with yesterday’s tools when you can receive the benefits of a truly flexible open-architecture ceramic layout solution with full Computer Aided Manufacturing (CAM) output, Design-For- Manufacture (DFM) with 3D visualization and checking?

The Only Unlimited Hybrid / MCM Design System

Thin film, thick film, co-fired (LTCC, HTCC) ceramic Hybrid / MCM designs are no longer a headache, but a fast and easy process when using EPD (Electronics Packaging Designer).  Why work with yesterday’s technologies when you can utilize our powerful Layout Versus Schematic (LVS) design system that ensures that the layout matches the schematic at all times? Also, insure proper clearances with our configurable Design Rule Checking (DRC). Realize die creation from any input, as well as an attach pattern fan-out generator with many unique features. Parametric and graphical building of through hole, surface mount, intelligent printed and etched elements, and thick film resistors in various shapes are standard.

Parametric and graphic building of through hole, surface mount, intelligent printed and etched elements, and resistors in various shapes are standard. Use a choice of positive fill, negative fill, positive boundary, and mixed plane/routing with extension commands for coplanar ground shields and automatic via peppering. Take advantage of via creation for through hole, blind/buried holes, LTCC, hybrid and MMIC technologies. Construct all dimensioning directly and within multiple layout-views for assembly drawings, fabrication drawings, bonding diagrams, etc. Generate artwork with utilities for RS274D and RS274X, GDSII, true type font support, true arc support, polygon fill support, etc.

Key Features Include:

• Design using any type of Ceramic MCM technology
  • All types of Ceramic Packages supported; LTCC, HTCC, Thick Film and Thin Film, with new technologies being implemented.
  • Manufacturing processes are built into the software.
  • Circuits and components may be equally built up on both sides of a thick or thin film hybrid substrate or LTCC dielectric.           
  • Any number of layers is possible on either side of a substrate on a Thick Film Ceramic Hybrid.
• Schematic (More Info)
  • Full hierarchical layout to schematic verification supports recursive nested circuits in blocks (cells).
  • Annotate schematic and PCB reference designators simultaneously using steering polygons and radiation points set up in either or both drawings.
  • Schematic symbols in libraries link to layout footprints.
  • Exports net lists in various formats.
  • Supports cross probing of Layout and Schematic.
  • User controllable preferences system.
  • Net design criteria exported to the layout through the net list.
• Layout vs. Schematic (LVS) Verification and Design Rule Checking (DRC)  (More Info)
  • Read in the net list from any source and compare it to the layout.
  • Layout designs without a net list and compare it to the net list later or capture the net list from the design.
  • Net names on the dies may be exported into the captured net list.
  • Advanced DRC (ADRC) with unlimited checking capabilities is configurable and handles special design rules.
  • Manufacturing rules checks.
• Component Creation  (More Info)
  • Advanced Die Capture is possible from many sources. It captures the signal names on the die and feeds them through the bond wires into the layout. Dies may be captured form the following sources.
    • MS Excel® Data – configurable import from custom formats.
    • AutoCAD® DWG or DXF Data.
    • GDS (GDSII) Data.
    • DIE file (LIQ, TXT, etc.).
    • Digital Photographs.
    • Scanned Images.
    • Parametric in a dialog.
  • The Die library allows a user to save die geometries as bare die and as part of intelligent bond wire fan-outs.
  • Net list and 3D DRC intelligence are contained in the bond wires.
  • Bond wire generation includes full parameter based bond wire fan-outs with many templates.
  • Fully flexible bond finger position and rotation editing.
  • Support for Flip Chip die mounting and redistribution on the silicon.
• Parametric libraries for: (More Info)
  • Automatic Parametric Component creation with IPC compatible libraries.
  • Through-hole components.
  • Surface mount components.
  • Embedded Passives: Capacitors, Resistors and Inductors parametrically created with user friendly GUI.
    • Thick film (Rectangular, Top Hat, Right Angle) and serpentine resistor creation and editing calculates laser trimming resistance range and wattage capacity.
• Visual (graphic) libraries for custom components:  (More Info)
  • Any uniquely created part.
  • Easy library maintenance.
  • A dedicated suite of utilities allows construction of custom components with any imaginable geometry on any layer.
• Component Placement  (More Info)
  • Parts are loaded after an automatic search of all libraries for footprints listed in the net list.
  • The Place command places components manually or semi-automatically with a high degree of precision that feeds into the DynaRat command.
  • The DynaRat command moves parts with precision while optimizing the rats dynamically.
• RF / Microwave Capabilities  (More Info)
  • Complex Ground and Power Planes with unlimited splits and automatic Coplanar Vias and optional crosshatches with pinhole filling.
  • Via peppering automatically placed with pattern control and DRC for violating via removal.
  • Differential Pair routing and various types of Length Tuning
  • Links to RF Analysis;
    • Agilent – ADS (full duplex).
    • Ansoft –HFSS            .
    • Sonnet.
    • Applied Wave Research – MWO.
    • CST – MWS.
• Advanced LTCC Hybrid Geometries  (More Info)
  • Advanced Stair Step Via creation with user friendly GUI that views the via as it is being configured.
  • Custom Entities can be defined for special materials.
  • Multi-level Cavity creation with user friendly GUI that views the cavity as it is being configured.
• Built in CAM Capabilities  (More Info)
  • Automatic CAM Configuration includes:
    • Gerber Output, Input and viewing.
    • Rotation about any specified point.
    • Equal and unequal X -Y Scaling.
    • Mirroring on any axis (X or Y).
    • Punch (drill) Output.
    • Four types of Punch Optimizations.
    • Panelization.
    • Many other configurable features.
  • Nibbler Data auto-generation with machine compatible output.
  • Outputs for epoxy dispense, component placement and wire bonding machines.
• Powerful features available only in this tool  (More Info)
  • Automatic Detailed Documentation with multiple sheets in the same drawing and multiple views on the same sheet.
  • Automatic Process Diagram Generation.
  • Advanced Built in Material Library with electrical, material and chemical properties.
  • Full 3D Imaging and Animation including fly throughs.
  • 3D checking of complex bonding pattern with wire bond yield analysis.
  • Volume / Mass report for all materials for new European requirements